Technical Documents
Specifications
Brand
SamtecNumber of Contacts
160
Product Type
PCB Socket
Number of Rows
2
Sub Type
Terminal Assembly
Pitch
0.5mm
Current
2.7A
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Stacking Height
10mm
Connector System
Board-to-Board
Voltage
339V
Series
ASP
Minimum Operating Temperature
-55°C
Row Pitch
6.18mm
Contact Gender
Male
Maximum Operating Temperature
125°C
Contact Material
Bronze
Contact Plating
Gold over Nickel
Standards/Approvals
RoHS
Country of Origin
Costa Rica
Product Details
Altera® HSMC defines electrical and mechanical properties of a high speed mezzanine card interface. This specification standardizes the way in which mezzanine cards communicate and connect to host boards. By taking advantage of the high-performance I/O features found in todays FPGA devices, manufacturers can build a single mezzanine card that will then interface to multiple host boards. Similarly, they can build a host board that can leverage many different, pre-built, mezzanine cards.
Stock information temporarily unavailable.
₪ 145.70
₪ 145.70 Each (ex VAT)
₪ 170.47
₪ 170.47 Each (inc. VAT)
1
₪ 145.70
₪ 145.70 Each (ex VAT)
₪ 170.47
₪ 170.47 Each (inc. VAT)
Stock information temporarily unavailable.
1
| quantity | Unit price |
|---|---|
| 1 - 9 | ₪ 145.70 |
| 10 - 49 | ₪ 138.69 |
| 50 - 99 | ₪ 132.50 |
| 100 - 249 | ₪ 127.02 |
| 250+ | ₪ 122.19 |
Technical Documents
Specifications
Brand
SamtecNumber of Contacts
160
Product Type
PCB Socket
Number of Rows
2
Sub Type
Terminal Assembly
Pitch
0.5mm
Current
2.7A
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Stacking Height
10mm
Connector System
Board-to-Board
Voltage
339V
Series
ASP
Minimum Operating Temperature
-55°C
Row Pitch
6.18mm
Contact Gender
Male
Maximum Operating Temperature
125°C
Contact Material
Bronze
Contact Plating
Gold over Nickel
Standards/Approvals
RoHS
Country of Origin
Costa Rica
Product Details
Altera® HSMC defines electrical and mechanical properties of a high speed mezzanine card interface. This specification standardizes the way in which mezzanine cards communicate and connect to host boards. By taking advantage of the high-performance I/O features found in todays FPGA devices, manufacturers can build a single mezzanine card that will then interface to multiple host boards. Similarly, they can build a host board that can leverage many different, pre-built, mezzanine cards.