Technical documents
Specifications
Brand
BergquistDimensions
200 x 100mm
Thickness
0.04in
Length
200mm
Width
100mm
Thermal Conductivity
0.9W/m·K
Material
Polymer
Self-Adhesive
Yes
Minimum Operating Temperature
-60°C
Maximum Operating Temperature
+125°C
Hardness
Shore OO 40
Operating Temperature Range
-60 → +125 °C
Country of Origin
United States
Product details
Gap Pad® 1000SF
Gap Pad® 1000SF is a thermally conductive, electrically insulating, silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications with high standoff and flatness tolerances. Gap Pad® 1000SF is reinforced for easy material handling and added durability during assembly. The material is available with a protective liner on both sides of the material. The topside has reduced tack for ease of handling. Typical applications include digital disk drives/CD-ROM, automotive modules and fibre optics modules.
Thermal conductivity: 0.9 W/m-K
No silicone outgassing
No silicone extraction
Reduced tack on one side to aid in application assembly
Electrically isolating
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₪ 240.76
Each (ex VAT)
₪ 281.69
Each (inc. VAT)
1
₪ 240.76
Each (ex VAT)
₪ 281.69
Each (inc. VAT)
1
Buy in bulk
quantity | Unit price |
---|---|
1 - 9 | ₪ 240.76 |
10 - 24 | ₪ 237.14 |
25+ | ₪ 233.28 |
Technical documents
Specifications
Brand
BergquistDimensions
200 x 100mm
Thickness
0.04in
Length
200mm
Width
100mm
Thermal Conductivity
0.9W/m·K
Material
Polymer
Self-Adhesive
Yes
Minimum Operating Temperature
-60°C
Maximum Operating Temperature
+125°C
Hardness
Shore OO 40
Operating Temperature Range
-60 → +125 °C
Country of Origin
United States
Product details
Gap Pad® 1000SF
Gap Pad® 1000SF is a thermally conductive, electrically insulating, silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications with high standoff and flatness tolerances. Gap Pad® 1000SF is reinforced for easy material handling and added durability during assembly. The material is available with a protective liner on both sides of the material. The topside has reduced tack for ease of handling. Typical applications include digital disk drives/CD-ROM, automotive modules and fibre optics modules.
Thermal conductivity: 0.9 W/m-K
No silicone outgassing
No silicone extraction
Reduced tack on one side to aid in application assembly
Electrically isolating