331151702562, Contact Finger of Gold Plated Beryllium Copper With Mounting Screw 7.15mm x 2.5mm x 6.2mm

RS Stock No.: 773-4261Brand: Wurth ElektronikManufacturers Part No.: 331151702562
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Technical documents

Specifications

Material

Gold Plated Beryllium Copper

Fixing Method

Mounting Screw

Thickness

6.2mm

Length

7.15mm

Width_SC_PC

2.5mm

Product details

Wurth Elektronik SMD EMI Contact Fingers - WE-SECF Series

Wurth WE-SECF series contact fingers are composed of gold-plated copper-beryllium for enhanced wear and corrosion resistance and can be SMD assembled by means of a pick-and-place process.

Suitable for automated placement
Material: copper-beryllium (CuBe) gold-plated (Au)
Different types and sizes available
Corrossion-resistant
Wear-resistant
High temperatures and mechenical weight have no influence on the excellent connection properties
Reliable solderability

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₪ 11.593

Each (In a Bag of 5) (ex VAT)

₪ 13.564

Each (In a Bag of 5) (inc VAT)

331151702562, Contact Finger of Gold Plated Beryllium Copper With Mounting Screw 7.15mm x 2.5mm x 6.2mm

₪ 11.593

Each (In a Bag of 5) (ex VAT)

₪ 13.564

Each (In a Bag of 5) (inc VAT)

331151702562, Contact Finger of Gold Plated Beryllium Copper With Mounting Screw 7.15mm x 2.5mm x 6.2mm
Stock information temporarily unavailable.

Buy in bulk

quantityUnit pricePer Bag
5 - 20₪ 11.593₪ 57.96
25 - 45₪ 11.201₪ 56.01
50 - 95₪ 10.446₪ 52.23
100 - 245₪ 10.124₪ 50.62
250+₪ 9.243₪ 46.22

Technical documents

Specifications

Material

Gold Plated Beryllium Copper

Fixing Method

Mounting Screw

Thickness

6.2mm

Length

7.15mm

Width_SC_PC

2.5mm

Product details

Wurth Elektronik SMD EMI Contact Fingers - WE-SECF Series

Wurth WE-SECF series contact fingers are composed of gold-plated copper-beryllium for enhanced wear and corrosion resistance and can be SMD assembled by means of a pick-and-place process.

Suitable for automated placement
Material: copper-beryllium (CuBe) gold-plated (Au)
Different types and sizes available
Corrossion-resistant
Wear-resistant
High temperatures and mechenical weight have no influence on the excellent connection properties
Reliable solderability