Technical documents
Specifications
Brand
WinslowPitch
0.65 mm, 2.54 mm
End 1
TSOP 24
End 2
DIP 24
End 1 Number of Contacts
24
End 2 Number of Contacts
24
End 1 Type
TSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Country of Origin
United Kingdom
Product details
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
₪ 806.70
₪ 161.34 Each (In a Pack of 5) (ex VAT)
₪ 943.84
₪ 188.768 Each (In a Pack of 5) (inc. VAT)
5
₪ 806.70
₪ 161.34 Each (In a Pack of 5) (ex VAT)
₪ 943.84
₪ 188.768 Each (In a Pack of 5) (inc. VAT)
Stock information temporarily unavailable.
5
Stock information temporarily unavailable.
| quantity | Unit price | Per Pack |
|---|---|---|
| 5 - 120 | ₪ 161.34 | ₪ 806.70 |
| 125 - 370 | ₪ 147.42 | ₪ 737.10 |
| 375 - 995 | ₪ 133.02 | ₪ 665.10 |
| 1000 - 1995 | ₪ 118.14 | ₪ 590.70 |
| 2000+ | ₪ 111.345 | ₪ 556.72 |
Technical documents
Specifications
Brand
WinslowPitch
0.65 mm, 2.54 mm
End 1
TSOP 24
End 2
DIP 24
End 1 Number of Contacts
24
End 2 Number of Contacts
24
End 1 Type
TSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Country of Origin
United Kingdom
Product details
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.


