Technical documents
Specifications
Brand
WinbondMemory Size
1Gbit
Interface Type
Quad-SPI
Package Type
TFBGA
Pin Count
24
Organisation
128M x 8 bit
Mounting Type
Surface Mount
Cell Type
SLC NAND
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Dimensions
8.1 x 6.1 x 0.85mm
Number of Bits per Word
8bit
Maximum Operating Temperature
+85 °C
Number of Words
128M
Minimum Operating Temperature
-40 °C
Stock information temporarily unavailable.
Please check again later.
₪ 19.382
Each (In a Tray of 480) (ex VAT)
₪ 22.677
Each (In a Tray of 480) (inc VAT)
480
₪ 19.382
Each (In a Tray of 480) (ex VAT)
₪ 22.677
Each (In a Tray of 480) (inc VAT)
480
Buy in bulk
quantity | Unit price | Per Tray |
---|---|---|
480 - 960 | ₪ 19.382 | ₪ 9,303.28 |
1440 - 4800 | ₪ 18.165 | ₪ 8,719.30 |
5280+ | ₪ 16.795 | ₪ 8,061.50 |
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products
Technical documents
Specifications
Brand
WinbondMemory Size
1Gbit
Interface Type
Quad-SPI
Package Type
TFBGA
Pin Count
24
Organisation
128M x 8 bit
Mounting Type
Surface Mount
Cell Type
SLC NAND
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Dimensions
8.1 x 6.1 x 0.85mm
Number of Bits per Word
8bit
Maximum Operating Temperature
+85 °C
Number of Words
128M
Minimum Operating Temperature
-40 °C