Technical documents
Specifications
Brand
WinbondMemory Size
2Gbit
Interface Type
Quad-SPI
Package Type
TFBGA
Pin Count
24
Organisation
256M x 8 bit
Mounting Type
Surface Mount
Cell Type
SLC NAND
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Dimensions
8.05 x 6.05 x 0.85mm
Number of Words
256M
Minimum Operating Temperature
-40 °C
Number of Bits per Word
8bit
Maximum Operating Temperature
+85 °C
Stock information temporarily unavailable.
Please check again later.
₪ 31.967
Each (In a Tray of 480) (ex VAT)
₪ 37.401
Each (In a Tray of 480) (inc VAT)
480
₪ 31.967
Each (In a Tray of 480) (ex VAT)
₪ 37.401
Each (In a Tray of 480) (inc VAT)
480
Buy in bulk
quantity | Unit price | Per Tray |
---|---|---|
480 - 480 | ₪ 31.967 | ₪ 15,344.36 |
960 - 960 | ₪ 31.058 | ₪ 14,908.06 |
1440 - 3840 | ₪ 30.01 | ₪ 14,404.64 |
4320+ | ₪ 27.241 | ₪ 13,075.60 |
Technical documents
Specifications
Brand
WinbondMemory Size
2Gbit
Interface Type
Quad-SPI
Package Type
TFBGA
Pin Count
24
Organisation
256M x 8 bit
Mounting Type
Surface Mount
Cell Type
SLC NAND
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Dimensions
8.05 x 6.05 x 0.85mm
Number of Words
256M
Minimum Operating Temperature
-40 °C
Number of Bits per Word
8bit
Maximum Operating Temperature
+85 °C