Technical documents
Specifications
Brand
TE ConnectivityPole Format
4
Product Type
Backplane Connector
Current
10A
Voltage
250V
Connector Gender
Female
Mount Type
Through Hole
Contact Material
Phosphor Bronze
Housing Material
Polyethylene Terephthalate
Minimum Operating Temperature
-55°C
Contact Gender
Female
Maximum Operating Temperature
125°C
Contact Plating
Gold over Palladium Nickel over Nickel
Standards/Approvals
No
Country of Origin
United States
Product details
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
Stock information temporarily unavailable.
₪ 1,249.50
₪ 62.48 Each (Supplied in a Tube) (ex VAT)
₪ 1,461.92
₪ 73.10 Each (Supplied in a Tube) (inc. VAT)
Production pack (Tube)
20
₪ 1,249.50
₪ 62.48 Each (Supplied in a Tube) (ex VAT)
₪ 1,461.92
₪ 73.10 Each (Supplied in a Tube) (inc. VAT)
Stock information temporarily unavailable.
Production pack (Tube)
20
| quantity | Unit price |
|---|---|
| 20 - 74 | ₪ 62.48 |
| 75 - 299 | ₪ 60.30 |
| 300 - 599 | ₪ 58.05 |
| 600+ | ₪ 56.07 |
Technical documents
Specifications
Brand
TE ConnectivityPole Format
4
Product Type
Backplane Connector
Current
10A
Voltage
250V
Connector Gender
Female
Mount Type
Through Hole
Contact Material
Phosphor Bronze
Housing Material
Polyethylene Terephthalate
Minimum Operating Temperature
-55°C
Contact Gender
Female
Maximum Operating Temperature
125°C
Contact Plating
Gold over Palladium Nickel over Nickel
Standards/Approvals
No
Country of Origin
United States
Product details
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.


