Technical documents
Specifications
Brand
TE ConnectivityNumber of Contacts
3
Product Type
PCB Socket
Sub Type
Board-to-Board
Pitch
2.54mm
Current
1.15A
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Through Hole
Orientation
Straight
Connector System
Board-to-Board
Voltage
250 V
Series
Z-PACK HM
Minimum Operating Temperature
-65°C
Contact Gender
Female
Maximum Operating Temperature
125°C
Contact Material
Copper
Contact Plating
Gold
Standards/Approvals
RoHS
Country of Origin
United States
Product details
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
Stock information temporarily unavailable.
₪ 981.00
₪ 49.05 Each (Supplied in a Tube) (ex VAT)
₪ 1,147.77
₪ 57.39 Each (Supplied in a Tube) (inc. VAT)
Production pack (Tube)
20
₪ 981.00
₪ 49.05 Each (Supplied in a Tube) (ex VAT)
₪ 1,147.77
₪ 57.39 Each (Supplied in a Tube) (inc. VAT)
Stock information temporarily unavailable.
Production pack (Tube)
20
| quantity | Unit price |
|---|---|
| 20 - 74 | ₪ 49.05 |
| 75 - 299 | ₪ 43.23 |
| 300 - 599 | ₪ 37.46 |
| 600+ | ₪ 35.67 |
Technical documents
Specifications
Brand
TE ConnectivityNumber of Contacts
3
Product Type
PCB Socket
Sub Type
Board-to-Board
Pitch
2.54mm
Current
1.15A
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Through Hole
Orientation
Straight
Connector System
Board-to-Board
Voltage
250 V
Series
Z-PACK HM
Minimum Operating Temperature
-65°C
Contact Gender
Female
Maximum Operating Temperature
125°C
Contact Material
Copper
Contact Plating
Gold
Standards/Approvals
RoHS
Country of Origin
United States
Product details
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.


