TE Connectivity, 2641606 2.54mm Pitch Straight 40 Way, PCB Mount Stamped Pin Ladder IC Dip Socket
Technical documents
Specifications
Brand
TE ConnectivityNumber Of Contacts
40
Mounting Type
PCB Mount
Pin Type
Stamped
Pitch
2.54mm
Row Width
15.49mm
Frame Type
Ladder
Termination Method
Solder
Contact Plating
Gold
Orientation
Straight
Length
50.67mm
Width
17.63mm
Depth
5.33mm
Dimensions
50.67 x 17.63 x 5.33mm
Series
2641606
Minimum Operating Temperature
-55°C
Maximum Operating Temperature
+125°C
Housing Material
Thermoplastic
Contact Material
Beryllium Copper
Country of Origin
China
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P.O.A.
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Technical documents
Specifications
Brand
TE ConnectivityNumber Of Contacts
40
Mounting Type
PCB Mount
Pin Type
Stamped
Pitch
2.54mm
Row Width
15.49mm
Frame Type
Ladder
Termination Method
Solder
Contact Plating
Gold
Orientation
Straight
Length
50.67mm
Width
17.63mm
Depth
5.33mm
Dimensions
50.67 x 17.63 x 5.33mm
Series
2641606
Minimum Operating Temperature
-55°C
Maximum Operating Temperature
+125°C
Housing Material
Thermoplastic
Contact Material
Beryllium Copper
Country of Origin
China
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products