Technical documents
Specifications
Brand
TE ConnectivityNumber Of Contacts
4
Number Of Rows
1
Body Orientation
Right Angle
Pitch
2mm
Contact Material
Copper Alloy
Mounting Type
Through Hole
Current Rating
16A
Termination Method
Press-Fit
Series
Z-PACK HM
Country of Origin
United States
Product details
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
₪ 2,367.78
₪ 62.31 Each (In a Tube of 38) (ex VAT)
₪ 2,770.30
₪ 72.903 Each (In a Tube of 38) (inc. VAT)
38
₪ 2,367.78
₪ 62.31 Each (In a Tube of 38) (ex VAT)
₪ 2,770.30
₪ 72.903 Each (In a Tube of 38) (inc. VAT)
Stock information temporarily unavailable.
38
Stock information temporarily unavailable.
Technical documents
Specifications
Brand
TE ConnectivityNumber Of Contacts
4
Number Of Rows
1
Body Orientation
Right Angle
Pitch
2mm
Contact Material
Copper Alloy
Mounting Type
Through Hole
Current Rating
16A
Termination Method
Press-Fit
Series
Z-PACK HM
Country of Origin
United States
Product details
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.


