TE Connectivity, Z-PACK HM 2 mm Pitch Hard Metric Type A Backplane Connector, Right Angle Male, 4 Column, 1 Row, 4 Way
Technical documents
Specifications
Brand
TE ConnectivityBackplane Connector Type
Hard Metric Type A
Product Type
Backplane Connector
Number of Contacts
4
Current
16A
Orientation
Right Angle
Number of Columns
4
Number of Rows
1
Connector Gender
Male
Voltage
250V
Housing Material
Glass Filled Polyester
Pitch
2mm
Contact Material
Copper Alloy
Mount Type
Through Hole
Contact Plating
Gold
Minimum Operating Temperature
-55°C
Termination Type
Press Fit
Contact Gender
Male
Maximum Operating Temperature
125°C
Standards/Approvals
No
Series
Z-PACK HM
Country of Origin
United States
Product details
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
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Stock information temporarily unavailable.
₪ 71.70
₪ 71.70 Each (ex VAT)
₪ 83.89
₪ 83.89 Each (inc. VAT)
Standard
1
₪ 71.70
₪ 71.70 Each (ex VAT)
₪ 83.89
₪ 83.89 Each (inc. VAT)
Stock information temporarily unavailable.
Standard
1
| quantity | Unit price |
|---|---|
| 1 - 19 | ₪ 71.70 |
| 20 - 74 | ₪ 69.15 |
| 75 - 299 | ₪ 66.74 |
| 300 - 599 | ₪ 64.32 |
| 600+ | ₪ 61.95 |
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products
Technical documents
Specifications
Brand
TE ConnectivityBackplane Connector Type
Hard Metric Type A
Product Type
Backplane Connector
Number of Contacts
4
Current
16A
Orientation
Right Angle
Number of Columns
4
Number of Rows
1
Connector Gender
Male
Voltage
250V
Housing Material
Glass Filled Polyester
Pitch
2mm
Contact Material
Copper Alloy
Mount Type
Through Hole
Contact Plating
Gold
Minimum Operating Temperature
-55°C
Termination Type
Press Fit
Contact Gender
Male
Maximum Operating Temperature
125°C
Standards/Approvals
No
Series
Z-PACK HM
Country of Origin
United States
Product details
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products