TDK Capacitor Array 1nF 50V dc ±20% 4-way X7R Dielectric , 1206 (3216M), CKC, Surface Mount
Technical documents
Specifications
Brand
TDKCapacitance
1nF
Series
CKC
Tolerance
±20%
Voltage
50V dc
Mounting Type
Surface Mount
Number of Capacitors
4
Dielectric
X7R
Package/Case
1206 (3216M)
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
Tolerance Minus
-20%
Tolerance Plus
+20%
Product details
TDK SMT 1206 commercial grade array, CKC series
TDK Multilayer Ceramic Chip Capacitors CKC Series 4 in 1 Array, CKCL44 and CKCA43 types.
Features and Benefits:
Multiple 4 in 1 array of multilayer ceramic chip capacitors in a single product, contributing to reduced installation costs
The electrostatic capacity range and shape are designed to meet the demands of the cellular phone market
Unique electrode construction reduces crosstalk within the package
Applications:
Cellular telephone interface
Interface cable circuit
PC and peripherals
CPU bus line
High frequency circuit
Noise bypass circuit
Network and Feed-through
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P.O.A.
50
P.O.A.
50
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products
Technical documents
Specifications
Brand
TDKCapacitance
1nF
Series
CKC
Tolerance
±20%
Voltage
50V dc
Mounting Type
Surface Mount
Number of Capacitors
4
Dielectric
X7R
Package/Case
1206 (3216M)
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
Tolerance Minus
-20%
Tolerance Plus
+20%
Product details
TDK SMT 1206 commercial grade array, CKC series
TDK Multilayer Ceramic Chip Capacitors CKC Series 4 in 1 Array, CKCL44 and CKCA43 types.
Features and Benefits:
Multiple 4 in 1 array of multilayer ceramic chip capacitors in a single product, contributing to reduced installation costs
The electrostatic capacity range and shape are designed to meet the demands of the cellular phone market
Unique electrode construction reduces crosstalk within the package
Applications:
Cellular telephone interface
Interface cable circuit
PC and peripherals
CPU bus line
High frequency circuit
Noise bypass circuit
Network and Feed-through
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products