RS PRO, 0402 (1005M) Multilayer Surface Mount Inductor with a Ceramic Core, 22 nH ±5% Wire-Wound 300mA Idc Q:8

Technical documents
Specifications
Brand
RS ProInductance
22 nH
Maximum dc Current
300mA
Package/Case
0402 (1005M)
Length
1.6mm
Depth
0.8mm
Height
0.8mm
Dimensions
1.6 x 0.8 x 0.8mm
Tolerance
±5%
Maximum DC Resistance
800mΩ
Series
CL
Core Material
Ceramic
Maximum Self Resonant Frequency
1.6GHz
Inductor Construction
Wire-Wound
Maximum Operating Temperature
+85°C
Minimum Quality Factor
8
Minimum Operating Temperature
-30°C
Product details
RS 0402 CL Series Multilayer Ceramic Inductor (reels)
Stable inductance in high frequency circuits
Compact 0402 size and manufactured to tight dimensional tolerances (+/- 0.05mm)
Tight inductance tolerance and excellent Q value
Applications include: High frequency applications; mobile phones and pagers; WLAN and RF modules; EMI Countermeasure in High Frequency Circuits and Computer Communications
₪ 120.00
₪ 0.12 Each (On a Reel of 1000) (ex VAT)
₪ 140.40
₪ 0.14 Each (On a Reel of 1000) (inc. VAT)
1000
₪ 120.00
₪ 0.12 Each (On a Reel of 1000) (ex VAT)
₪ 140.40
₪ 0.14 Each (On a Reel of 1000) (inc. VAT)
1000
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Please check again later.
quantity | Unit price | Per Reel |
---|---|---|
1000 - 4000 | ₪ 0.12 | ₪ 120.00 |
5000 - 9000 | ₪ 0.105 | ₪ 105.00 |
10000+ | ₪ 0.09 | ₪ 90.00 |
Technical documents
Specifications
Brand
RS ProInductance
22 nH
Maximum dc Current
300mA
Package/Case
0402 (1005M)
Length
1.6mm
Depth
0.8mm
Height
0.8mm
Dimensions
1.6 x 0.8 x 0.8mm
Tolerance
±5%
Maximum DC Resistance
800mΩ
Series
CL
Core Material
Ceramic
Maximum Self Resonant Frequency
1.6GHz
Inductor Construction
Wire-Wound
Maximum Operating Temperature
+85°C
Minimum Quality Factor
8
Minimum Operating Temperature
-30°C
Product details
RS 0402 CL Series Multilayer Ceramic Inductor (reels)
Stable inductance in high frequency circuits
Compact 0402 size and manufactured to tight dimensional tolerances (+/- 0.05mm)
Tight inductance tolerance and excellent Q value
Applications include: High frequency applications; mobile phones and pagers; WLAN and RF modules; EMI Countermeasure in High Frequency Circuits and Computer Communications