Multicore Wire, 0.5mm Lead Free Solder, 217°C Melting Point
Technical documents
Specifications
Brand
MulticoreWire Diameter
0.5mm
Model Number
C400
Percent Lead
0%
Product Form
Wire
Melting Point
217°C
Percent Silver
3.8%
Percent Tin
95.5%
Flux Type
Activated Rosin
Product Weight
250g
Flux Content Percent
3%
Percent Copper
0.7%
Country of Origin
Malaysia
Product details
Solder wire Sn95.5 Ag3.5 Cu0.7
96SC Crystal 400 No-Clean solder wire with incorporated flux.
On a spool.
Halide-free.
Constant heat, low spatter.
High speed soldering, range of activities suitable for all applications.
Good spread on copper, brass and nickel.
Clear residue.
Standards
J-STD-004, EN29453.
P.O.A.
1
P.O.A.
1
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Technical documents
Specifications
Brand
MulticoreWire Diameter
0.5mm
Model Number
C400
Percent Lead
0%
Product Form
Wire
Melting Point
217°C
Percent Silver
3.8%
Percent Tin
95.5%
Flux Type
Activated Rosin
Product Weight
250g
Flux Content Percent
3%
Percent Copper
0.7%
Country of Origin
Malaysia
Product details
Solder wire Sn95.5 Ag3.5 Cu0.7
96SC Crystal 400 No-Clean solder wire with incorporated flux.
On a spool.
Halide-free.
Constant heat, low spatter.
High speed soldering, range of activities suitable for all applications.
Good spread on copper, brass and nickel.
Clear residue.
Standards
J-STD-004, EN29453.