Technical documents
Specifications
Brand
MolexSeries
PMC Mezzanine
Pitch
1.0mm
Number Of Contacts
64
Number Of Rows
2
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Mounting Type
Surface Mount
Connector System
Board to Board
Termination Method
Solder
Contact Material
Phosphor Bronze
Contact Plating
Gold
Series Number
71436
Current Rating
1.0A
Voltage Rating
100.0 V
Country of Origin
United States
Product details
Vertical Stacking SMT Headers & Sockets 64 Way
A range of 1.00mm Pitch Mezzanine IEEE 1386 Receptacles, Surface Mount (SMT) in Dual Row for Vertical Stacking applications.
Allows PCI and S-bus (IEEE 1386) mezzanine cards to connect to VMEbus and Multibus host boards
Suitable for LAN, WAN, telecommunication, PC and workstation applications
Shrouded leaf design (minimises damaging header contacts)
Low insertion force sockets
High-temperature LCP housing for use with reflow solder processes
Antiflux design
Mated heights: 8 → 15mm (see combination guide)
Approvals
UL recognised component
₪ 54.39
₪ 54.39 Each (ex VAT)
₪ 63.64
₪ 63.64 Each (inc. VAT)
Standard
1
₪ 54.39
₪ 54.39 Each (ex VAT)
₪ 63.64
₪ 63.64 Each (inc. VAT)
Stock information temporarily unavailable.
Standard
1
Stock information temporarily unavailable.
| quantity | Unit price |
|---|---|
| 1 - 19 | ₪ 54.39 |
| 20 - 74 | ₪ 48.42 |
| 75 - 299 | ₪ 46.76 |
| 300+ | ₪ 40.30 |
Technical documents
Specifications
Brand
MolexSeries
PMC Mezzanine
Pitch
1.0mm
Number Of Contacts
64
Number Of Rows
2
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Mounting Type
Surface Mount
Connector System
Board to Board
Termination Method
Solder
Contact Material
Phosphor Bronze
Contact Plating
Gold
Series Number
71436
Current Rating
1.0A
Voltage Rating
100.0 V
Country of Origin
United States
Product details
Vertical Stacking SMT Headers & Sockets 64 Way
A range of 1.00mm Pitch Mezzanine IEEE 1386 Receptacles, Surface Mount (SMT) in Dual Row for Vertical Stacking applications.
Allows PCI and S-bus (IEEE 1386) mezzanine cards to connect to VMEbus and Multibus host boards
Suitable for LAN, WAN, telecommunication, PC and workstation applications
Shrouded leaf design (minimises damaging header contacts)
Low insertion force sockets
High-temperature LCP housing for use with reflow solder processes
Antiflux design
Mated heights: 8 → 15mm (see combination guide)
Approvals
UL recognised component


