MBO Paste Lead solder, 179°C Melting Point
Technical documents
Specifications
Brand
MBOModel Number
SIRIUS 1
Percent Lead
36%
Product Form
Paste
Melting Point
179°C
Percent Silver
2%
Percent Tin
62%
Flux Type
Rosin
Product Weight
100g
Flux Content Percent
14%
Country of Origin
France
Product details
Sirius 1 solder paste Sn62 Pb Ag2
No-Clean solder paste suitable for stencil printing in reflow processes.
Fine pitch capability (400 μm).
High activity.
Minimal residue, neutral and colourless.
Chlorine-free.
Standards
NFC90550; J-STD-006; EN 29453
Solder Paste - Leaded
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P.O.A.
1
P.O.A.
1
Technical documents
Specifications
Brand
MBOModel Number
SIRIUS 1
Percent Lead
36%
Product Form
Paste
Melting Point
179°C
Percent Silver
2%
Percent Tin
62%
Flux Type
Rosin
Product Weight
100g
Flux Content Percent
14%
Country of Origin
France
Product details
Sirius 1 solder paste Sn62 Pb Ag2
No-Clean solder paste suitable for stencil printing in reflow processes.
Fine pitch capability (400 μm).
High activity.
Minimal residue, neutral and colourless.
Chlorine-free.
Standards
NFC90550; J-STD-006; EN 29453