Fischer Elektronik Heatsink, Universal Rectangular Alu with Fan 120 mm 150 mm 122mm

RS Stock No.: 692-0590Brand: Fischer ElektronikManufacturers Part No.: LA 17 150 230 VDistrelec Article No.: 30411271
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Technical documents

Specifications

Product Type

Heatsink

For Use With

Universal Rectangular Alu with Fan

Length

150mm

Width

122mm

Height

120mm

Finish

Black Anodised

Standards/Approvals

No

Application

Cooling

Material

Aluminium

Country of Origin

China

Product details

Fischer Elektronik Cooling Aggregates with Axial Fans

Fischer Elektronik cooling aggregates with fitted axial fans offer a versatile and efficient cooling solution in high powered applications where heat dissipation is only possible by forced convection. With a range of sizes to suit an array of requirements, Fischer Elektronik cooling aggregates are ideal.

Geometry of optimising the airflow
Particularly effective heat dissipation
Compact construction
Milled flat semiconductor mounting surface

View all in Heatsinks

Stock information temporarily unavailable.

₪ 891.92

₪ 891.92 Each (ex VAT)

₪ 1,043.55

₪ 1,043.55 Each (inc. VAT)

Fischer Elektronik Heatsink, Universal Rectangular Alu with Fan 120 mm 150 mm 122mm

₪ 891.92

₪ 891.92 Each (ex VAT)

₪ 1,043.55

₪ 1,043.55 Each (inc. VAT)

Fischer Elektronik Heatsink, Universal Rectangular Alu with Fan 120 mm 150 mm 122mm

Stock information temporarily unavailable.

Technical documents

Specifications

Product Type

Heatsink

For Use With

Universal Rectangular Alu with Fan

Length

150mm

Width

122mm

Height

120mm

Finish

Black Anodised

Standards/Approvals

No

Application

Cooling

Material

Aluminium

Country of Origin

China

Product details

Fischer Elektronik Cooling Aggregates with Axial Fans

Fischer Elektronik cooling aggregates with fitted axial fans offer a versatile and efficient cooling solution in high powered applications where heat dissipation is only possible by forced convection. With a range of sizes to suit an array of requirements, Fischer Elektronik cooling aggregates are ideal.

Geometry of optimising the airflow
Particularly effective heat dissipation
Compact construction
Milled flat semiconductor mounting surface