Technical documents
Specifications
Brand
BournsTrip Current
5.2A
Voltage Rating
6V
Time to Trip
5s
Hold Current
2.6A
Maximum Current
100 A
Length
4.73mm
Height
0.85mm
Width
3.41mm
Terminal Material
Electroless Nickel Immersion Gold
Minimum Resistance
0.015Ω
Maximum Resistance
80mΩ
Power Dissipation
0.8W
Minimum Operating Temperature
-40°C
Package Size
1812
Maximum Operating Temperature
+85°C
Operating Temperature Range
-40 → +85 °C
Dimensions
4.73 x 3.41 x 0.85mm
Product details
MF-MSMF Series
Compliant with AEC-Q200 Rev-C- Stress Test Qualification for Passive Components in Automotive Applications
100 % electrically compatible with all previous generations of 1812 SMT devices
Compatible with Pb and Pb-free solder reflow profiles
Surface mount packaging for automated assembly
Surface Mount Technology
Stock information temporarily unavailable.
₪ 445.50
₪ 4.455 Each (Supplied on a Reel) (ex VAT)
₪ 521.24
₪ 5.212 Each (Supplied on a Reel) (inc. VAT)
Production pack (Reel)
100
₪ 445.50
₪ 4.455 Each (Supplied on a Reel) (ex VAT)
₪ 521.24
₪ 5.212 Each (Supplied on a Reel) (inc. VAT)
Stock information temporarily unavailable.
Production pack (Reel)
100
| quantity | Unit price | Per Reel |
|---|---|---|
| 100 - 490 | ₪ 4.455 | ₪ 44.55 |
| 500 - 1490 | ₪ 3.495 | ₪ 34.95 |
| 1500 - 2490 | ₪ 3.12 | ₪ 31.20 |
| 2500+ | ₪ 2.76 | ₪ 27.60 |
Technical documents
Specifications
Brand
BournsTrip Current
5.2A
Voltage Rating
6V
Time to Trip
5s
Hold Current
2.6A
Maximum Current
100 A
Length
4.73mm
Height
0.85mm
Width
3.41mm
Terminal Material
Electroless Nickel Immersion Gold
Minimum Resistance
0.015Ω
Maximum Resistance
80mΩ
Power Dissipation
0.8W
Minimum Operating Temperature
-40°C
Package Size
1812
Maximum Operating Temperature
+85°C
Operating Temperature Range
-40 → +85 °C
Dimensions
4.73 x 3.41 x 0.85mm
Product details
MF-MSMF Series
Compliant with AEC-Q200 Rev-C- Stress Test Qualification for Passive Components in Automotive Applications
100 % electrically compatible with all previous generations of 1812 SMT devices
Compatible with Pb and Pb-free solder reflow profiles
Surface mount packaging for automated assembly
