Technical documents
Specifications
Brand
BournsTrip Current
4A
Voltage Rating
8V
Time to Trip
3s
Hold Current
2A
Maximum Current
40 A
Length
4.73mm
Height
0.85mm
Width
3.41mm
Terminal Material
Electroless Nickel Immersion Gold
Minimum Resistance
0.02Ω
Maximum Resistance
80mΩ
Power Dissipation
0.8W
Minimum Operating Temperature
-40°C
Package Size
1812
Maximum Operating Temperature
+85°C
Operating Temperature Range
-40 → +85 °C
Dimensions
4.73 x 3.41 x 0.85mm
Product details
MF-MSMF Series
Compliant with AEC-Q200 Rev-C- Stress Test Qualification for Passive Components in Automotive Applications
100 % electrically compatible with all previous generations of 1812 SMT devices
Compatible with Pb and Pb-free solder reflow profiles
Surface mount packaging for automated assembly
Surface Mount Technology
₪ 372.00
₪ 3.72 Each (Supplied on a Reel) (ex VAT)
₪ 435.24
₪ 4.352 Each (Supplied on a Reel) (inc. VAT)
Production pack (Reel)
100
₪ 372.00
₪ 3.72 Each (Supplied on a Reel) (ex VAT)
₪ 435.24
₪ 4.352 Each (Supplied on a Reel) (inc. VAT)
Stock information temporarily unavailable.
Production pack (Reel)
100
Stock information temporarily unavailable.
| quantity | Unit price | Per Reel |
|---|---|---|
| 100 - 490 | ₪ 3.72 | ₪ 37.20 |
| 500 - 1490 | ₪ 3.615 | ₪ 36.15 |
| 1500 - 2490 | ₪ 3.51 | ₪ 35.10 |
| 2500+ | ₪ 3.405 | ₪ 34.05 |
Technical documents
Specifications
Brand
BournsTrip Current
4A
Voltage Rating
8V
Time to Trip
3s
Hold Current
2A
Maximum Current
40 A
Length
4.73mm
Height
0.85mm
Width
3.41mm
Terminal Material
Electroless Nickel Immersion Gold
Minimum Resistance
0.02Ω
Maximum Resistance
80mΩ
Power Dissipation
0.8W
Minimum Operating Temperature
-40°C
Package Size
1812
Maximum Operating Temperature
+85°C
Operating Temperature Range
-40 → +85 °C
Dimensions
4.73 x 3.41 x 0.85mm
Product details
MF-MSMF Series
Compliant with AEC-Q200 Rev-C- Stress Test Qualification for Passive Components in Automotive Applications
100 % electrically compatible with all previous generations of 1812 SMT devices
Compatible with Pb and Pb-free solder reflow profiles
Surface mount packaging for automated assembly
