Technical documents
Specifications
Brand
BournsTrip Current
2.2A
Voltage Rating
16V
Time to Trip
0.3s
Hold Current
1.1A
Maximum Current
100 A
Length
4.73mm
Height
0.85mm
Width
3.41mm
Terminal Material
Electroless Nickel Immersion Gold
Minimum Resistance
0.04Ω
Maximum Resistance
210mΩ
Power Dissipation
0.8W
Minimum Operating Temperature
-40°C
Package Size
1812
Maximum Operating Temperature
+85°C
Operating Temperature Range
-40 → +85 °C
Dimensions
4.73 x 3.41 x 0.85mm
Product details
MF-MSMF Series
Compliant with AEC-Q200 Rev-C- Stress Test Qualification for Passive Components in Automotive Applications
100 % electrically compatible with all previous generations of 1812 SMT devices
Compatible with Pb and Pb-free solder reflow profiles
Surface mount packaging for automated assembly
Surface Mount Technology
₪ 55.35
₪ 5.535 Each (In a Pack of 10) (ex VAT)
₪ 64.76
₪ 6.476 Each (In a Pack of 10) (inc. VAT)
Standard
10
₪ 55.35
₪ 5.535 Each (In a Pack of 10) (ex VAT)
₪ 64.76
₪ 6.476 Each (In a Pack of 10) (inc. VAT)
Stock information temporarily unavailable.
Standard
10
Stock information temporarily unavailable.
| quantity | Unit price | Per Pack | 
|---|---|---|
| 10 - 90 | ₪ 5.535 | ₪ 55.35 | 
| 100 - 490 | ₪ 3.735 | ₪ 37.35 | 
| 500 - 1490 | ₪ 2.97 | ₪ 29.70 | 
| 1500 - 2490 | ₪ 2.94 | ₪ 29.40 | 
| 2500+ | ₪ 2.91 | ₪ 29.10 | 
Technical documents
Specifications
Brand
BournsTrip Current
2.2A
Voltage Rating
16V
Time to Trip
0.3s
Hold Current
1.1A
Maximum Current
100 A
Length
4.73mm
Height
0.85mm
Width
3.41mm
Terminal Material
Electroless Nickel Immersion Gold
Minimum Resistance
0.04Ω
Maximum Resistance
210mΩ
Power Dissipation
0.8W
Minimum Operating Temperature
-40°C
Package Size
1812
Maximum Operating Temperature
+85°C
Operating Temperature Range
-40 → +85 °C
Dimensions
4.73 x 3.41 x 0.85mm
Product details
MF-MSMF Series
Compliant with AEC-Q200 Rev-C- Stress Test Qualification for Passive Components in Automotive Applications
100 % electrically compatible with all previous generations of 1812 SMT devices
Compatible with Pb and Pb-free solder reflow profiles
Surface mount packaging for automated assembly
