Technical documents
Specifications
Brand
BournsTrip Current
1.5A
Voltage Rating
13.2V
Time to Trip
0.2s
Hold Current
0.75A
Maximum Current
100 A
Length
4.73mm
Height
0.85mm
Width
3.41mm
Terminal Material
Electroless Nickel Immersion Gold
Minimum Resistance
0.11Ω
Maximum Resistance
450mΩ
Power Dissipation
0.8W
Minimum Operating Temperature
-40°C
Package Size
1812
Maximum Operating Temperature
+85°C
Dimensions
4.73 x 3.41 x 0.85mm
Operating Temperature Range
-40 → +85 °C
Product details
MF-MSMF Series
Compliant with AEC-Q200 Rev-C- Stress Test Qualification for Passive Components in Automotive Applications
100 % electrically compatible with all previous generations of 1812 SMT devices
Compatible with Pb and Pb-free solder reflow profiles
Surface mount packaging for automated assembly
Surface Mount Technology
₪ 38.85
₪ 3.885 Each (In a Pack of 10) (ex VAT)
₪ 45.45
₪ 4.545 Each (In a Pack of 10) (inc. VAT)
Standard
10
₪ 38.85
₪ 3.885 Each (In a Pack of 10) (ex VAT)
₪ 45.45
₪ 4.545 Each (In a Pack of 10) (inc. VAT)
Standard
10
Stock information temporarily unavailable.
Please check again later.
quantity | Unit price | Per Pack |
---|---|---|
10 - 40 | ₪ 3.885 | ₪ 38.85 |
50 - 240 | ₪ 3.15 | ₪ 31.50 |
250 - 490 | ₪ 2.565 | ₪ 25.65 |
500 - 990 | ₪ 2.535 | ₪ 25.35 |
1000+ | ₪ 2.49 | ₪ 24.90 |
Technical documents
Specifications
Brand
BournsTrip Current
1.5A
Voltage Rating
13.2V
Time to Trip
0.2s
Hold Current
0.75A
Maximum Current
100 A
Length
4.73mm
Height
0.85mm
Width
3.41mm
Terminal Material
Electroless Nickel Immersion Gold
Minimum Resistance
0.11Ω
Maximum Resistance
450mΩ
Power Dissipation
0.8W
Minimum Operating Temperature
-40°C
Package Size
1812
Maximum Operating Temperature
+85°C
Dimensions
4.73 x 3.41 x 0.85mm
Operating Temperature Range
-40 → +85 °C
Product details
MF-MSMF Series
Compliant with AEC-Q200 Rev-C- Stress Test Qualification for Passive Components in Automotive Applications
100 % electrically compatible with all previous generations of 1812 SMT devices
Compatible with Pb and Pb-free solder reflow profiles
Surface mount packaging for automated assembly