Technical documents
Specifications
Brand
BournsTrip Current
0.3A
Voltage Rating
60V
Time to Trip
1.5s
Hold Current
0.1A
Maximum Current
40 A
Length
4.73mm
Height
1.1mm
Width
3.41mm
Terminal Material
Electroless Nickel Immersion Gold
Minimum Resistance
0.7Ω
Maximum Resistance
15Ω
Power Dissipation
0.8W
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
+85°C
Package Size
1812
Operating Temperature Range
-40 → +85 °C
Series
MF-MSMF
Dimensions
4.73 x 3.41 x 1.1mm
Product details
MF-MSMF Series
Compliant with AEC-Q200 Rev-C- Stress Test Qualification for Passive Components in Automotive Applications
100 % electrically compatible with all previous generations of 1812 SMT devices
Compatible with Pb and Pb-free solder reflow profiles
Surface mount packaging for automated assembly
Surface Mount Technology
Stock information temporarily unavailable.
₪ 256.50
₪ 2.565 Each (Supplied on a Reel) (ex VAT)
₪ 300.10
₪ 3.001 Each (Supplied on a Reel) (inc. VAT)
Production pack (Reel)
100
₪ 256.50
₪ 2.565 Each (Supplied on a Reel) (ex VAT)
₪ 300.10
₪ 3.001 Each (Supplied on a Reel) (inc. VAT)
Stock information temporarily unavailable.
Production pack (Reel)
100
| quantity | Unit price | Per Reel |
|---|---|---|
| 100 - 490 | ₪ 2.565 | ₪ 25.65 |
| 500 - 1490 | ₪ 2.535 | ₪ 25.35 |
| 1500 - 2490 | ₪ 2.49 | ₪ 24.90 |
| 2500+ | ₪ 2.475 | ₪ 24.75 |
Technical documents
Specifications
Brand
BournsTrip Current
0.3A
Voltage Rating
60V
Time to Trip
1.5s
Hold Current
0.1A
Maximum Current
40 A
Length
4.73mm
Height
1.1mm
Width
3.41mm
Terminal Material
Electroless Nickel Immersion Gold
Minimum Resistance
0.7Ω
Maximum Resistance
15Ω
Power Dissipation
0.8W
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
+85°C
Package Size
1812
Operating Temperature Range
-40 → +85 °C
Series
MF-MSMF
Dimensions
4.73 x 3.41 x 1.1mm
Product details
MF-MSMF Series
Compliant with AEC-Q200 Rev-C- Stress Test Qualification for Passive Components in Automotive Applications
100 % electrically compatible with all previous generations of 1812 SMT devices
Compatible with Pb and Pb-free solder reflow profiles
Surface mount packaging for automated assembly
