Bergquist Self-Adhesive Thermal Interface Sheet, 0.102mm Thick, 1W/m·K, Hi-Flow 225F-AC, 11 x 12in

RS Stock No.: 127-041Brand: BergquistManufacturers Part No.: HF225FAC-0.004-AC-1112
brand-logo
View all in Thermal Pads

Technical documents

Specifications

Brand

Bergquist

Dimensions

11 x 12in

Thickness

0.102mm

Length

11in

Width

12in

Thermal Conductivity

1W/m·K

Material

Hi-Flow 225F-AC

Self-Adhesive

Yes

Maximum Operating Temperature

+120°C

Material Trade Name

Hi-Flow 225F-AC

Operating Temperature Range

Maximum of +120 °C

Country of Origin

United States

Product details

Hi-Flow® 225 FAC

Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance computer processor,Power semiconductors ,Power modules

Thermal impedance : 0.1°C-in²/W (@25psi)
Phase Change Temperature : 55°C
Carrier thickness : 0.038mm

You may be interested in
Stock information temporarily unavailable.

₪ 311.82

₪ 311.82 Each (ex VAT)

₪ 364.83

₪ 364.83 Each (inc. VAT)

Bergquist Self-Adhesive Thermal Interface Sheet, 0.102mm Thick, 1W/m·K, Hi-Flow 225F-AC, 11 x 12in

1

Available in multiples of 1
1₪ 311.82
2₪ 623.64
3₪ 935.46
4₪ 1,247.28
5₪ 1,559.10
6₪ 1,870.92
7₪ 2,182.74
8₪ 2,494.56
9₪ 2,806.38
10₪ 3,118.20
11₪ 3,430.02
12₪ 3,741.84
13₪ 4,053.66
14₪ 4,365.48
15₪ 4,677.30

₪ 311.82

₪ 311.82 Each (ex VAT)

₪ 364.83

₪ 364.83 Each (inc. VAT)

Bergquist Self-Adhesive Thermal Interface Sheet, 0.102mm Thick, 1W/m·K, Hi-Flow 225F-AC, 11 x 12in
Stock information temporarily unavailable.

1

Available in multiples of 1
1₪ 311.82
2₪ 623.64
3₪ 935.46
4₪ 1,247.28
5₪ 1,559.10
6₪ 1,870.92
7₪ 2,182.74
8₪ 2,494.56
9₪ 2,806.38
10₪ 3,118.20
11₪ 3,430.02
12₪ 3,741.84
13₪ 4,053.66
14₪ 4,365.48
15₪ 4,677.30

Stock information temporarily unavailable.

Please check again later.

quantityUnit price
1 - 49₪ 311.82
50 - 99₪ 282.09
100 - 249₪ 251.04
250 - 499₪ 237.87
500+₪ 231.10
You may be interested in

Technical documents

Specifications

Brand

Bergquist

Dimensions

11 x 12in

Thickness

0.102mm

Length

11in

Width

12in

Thermal Conductivity

1W/m·K

Material

Hi-Flow 225F-AC

Self-Adhesive

Yes

Maximum Operating Temperature

+120°C

Material Trade Name

Hi-Flow 225F-AC

Operating Temperature Range

Maximum of +120 °C

Country of Origin

United States

Product details

Hi-Flow® 225 FAC

Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance computer processor,Power semiconductors ,Power modules

Thermal impedance : 0.1°C-in²/W (@25psi)
Phase Change Temperature : 55°C
Carrier thickness : 0.038mm

You may be interested in