Technical documents
Specifications
Brand
TE ConnectivityNumber Of Contacts
40
Number Of Rows
2
Pitch
1.27mm
Type
Socket Strip
Mounting Type
Surface Mount
Body Orientation
Straight
Termination Method
Solder
Current Rating
12A
Voltage Rating
30 V
Series
AMPMODU System 50
Contact Material
Copper
Country of Origin
United States
Product details
TE connectivity AMPMODU 50/50 1.27mm x 1.27mm Grid Board to Board Vertical Receptacles
AMPMODU 50/50 1.27mm x 1.27mm grid board to board vertical receptacles for SMT parallel board to board stacking in high density .050 x .050 applications. Parallel board to board stack heights of 6.35mm, 8.13mm and 9.91mm can by achieved using the same receptacle and selecting the appropriate header (board to board .050 x.050 double row vertical and right angle headers). These AMPMODU 50/50 1.27mm x 1.27mm vertical SMT board to board receptacle connectors have UL 94V-0 black glass filled thermoplastic housings, PCB hold down posts, polarizing tabs, gold plated contacts and are compatible with IR (infrared) and VPR(vapour phase reflow) surface mount processes.
Approvals
UL 94V-0
TE Connectivity AMPMODU 50/50 1.27mm Connectors
The TE Connectivity Modu 50/50 is a high density 1.27mm grid board to board connection system for SMT assembly. Choice of three different heights for PCB headers allows versatile stacking solutions to be achieved.
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₪ 79.527
Each (In a Tube of 17) (ex VAT)
₪ 93.047
Each (In a Tube of 17) (inc VAT)
17
₪ 79.527
Each (In a Tube of 17) (ex VAT)
₪ 93.047
Each (In a Tube of 17) (inc VAT)
17
Technical documents
Specifications
Brand
TE ConnectivityNumber Of Contacts
40
Number Of Rows
2
Pitch
1.27mm
Type
Socket Strip
Mounting Type
Surface Mount
Body Orientation
Straight
Termination Method
Solder
Current Rating
12A
Voltage Rating
30 V
Series
AMPMODU System 50
Contact Material
Copper
Country of Origin
United States
Product details
TE connectivity AMPMODU 50/50 1.27mm x 1.27mm Grid Board to Board Vertical Receptacles
AMPMODU 50/50 1.27mm x 1.27mm grid board to board vertical receptacles for SMT parallel board to board stacking in high density .050 x .050 applications. Parallel board to board stack heights of 6.35mm, 8.13mm and 9.91mm can by achieved using the same receptacle and selecting the appropriate header (board to board .050 x.050 double row vertical and right angle headers). These AMPMODU 50/50 1.27mm x 1.27mm vertical SMT board to board receptacle connectors have UL 94V-0 black glass filled thermoplastic housings, PCB hold down posts, polarizing tabs, gold plated contacts and are compatible with IR (infrared) and VPR(vapour phase reflow) surface mount processes.
Approvals
UL 94V-0
TE Connectivity AMPMODU 50/50 1.27mm Connectors
The TE Connectivity Modu 50/50 is a high density 1.27mm grid board to board connection system for SMT assembly. Choice of three different heights for PCB headers allows versatile stacking solutions to be achieved.