Bergquist Self-Adhesive Thermal Interface Sheet, 0.102mm Thick, 1W/m·K, Hi-Flow 225F-AC, 11 x 12in
Technical documents
Specifications
Brand
BergquistDimensions
11 x 12in
Thickness
0.102mm
Length
11in
Width
12in
Thermal Conductivity
1W/m·K
Material
Hi-Flow 225F-AC
Self-Adhesive
Yes
Maximum Operating Temperature
+120°C
Material Trade Name
Hi-Flow 225F-AC
Operating Temperature Range
Maximum of +120 °C
Country of Origin
United States
Product details
Hi-Flow® 225 FAC
Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance computer processor,Power semiconductors ,Power modules
Thermal impedance : 0.1°C-in²/W (@25psi)
Phase Change Temperature : 55°C
Carrier thickness : 0.038mm
₪ 311.82
₪ 311.82 Each (ex VAT)
₪ 364.83
₪ 364.83 Each (inc. VAT)
1
₪ 311.82
₪ 311.82 Each (ex VAT)
₪ 364.83
₪ 364.83 Each (inc. VAT)
1
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| quantity | Unit price |
|---|---|
| 1 - 49 | ₪ 311.82 |
| 50 - 99 | ₪ 282.09 |
| 100 - 249 | ₪ 251.04 |
| 250 - 499 | ₪ 237.87 |
| 500+ | ₪ 231.10 |
Technical documents
Specifications
Brand
BergquistDimensions
11 x 12in
Thickness
0.102mm
Length
11in
Width
12in
Thermal Conductivity
1W/m·K
Material
Hi-Flow 225F-AC
Self-Adhesive
Yes
Maximum Operating Temperature
+120°C
Material Trade Name
Hi-Flow 225F-AC
Operating Temperature Range
Maximum of +120 °C
Country of Origin
United States
Product details
Hi-Flow® 225 FAC
Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance computer processor,Power semiconductors ,Power modules
Thermal impedance : 0.1°C-in²/W (@25psi)
Phase Change Temperature : 55°C
Carrier thickness : 0.038mm