Steel Mechanical Brushed Code Lock

RS Stock No.: 687-9877Brand: CodelockManufacturers Part No.: CL615BS
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Technical documents

Specifications

Series

TSW-107-07-L-D-006

Kit Type

First Responder Bag

Thread Length

17.5mm

Maximum Output Torque

1482 gcm

Dimensions

210 x 75 x 50mm

Free Length

94mm

Material

Steel

Country of Origin

China

Product details

TE connectivity AMPMODU 50/50 1.27mm x 1.27mm Double Row Board to Board Vertical Headers

AMPMODU 50/50 double row board to board SMT PCB mount vertical headers with a high density 1.27mm x 1.27mm centerline and a 6.35mm mated height for parallel board to board applications. These AMPMODU 50/50 board to board headers have metallic board holddowns, dual beam receptacle contacts and black UL 94V-0 LCP housings with keying to aid accurate mating.

TE Connectivity AMPMODU 50/50 1.27mm Connectors

The TE Connectivity Modu 50/50 is a high density 1.27mm grid board to board connection system for SMT assembly. Choice of three different heights for PCB headers allows versatile stacking solutions to be achieved.

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₪ 2,292.38

Each (ex VAT)

₪ 2,682.09

Each (inc VAT)

Steel Mechanical Brushed Code Lock

₪ 2,292.38

Each (ex VAT)

₪ 2,682.09

Each (inc VAT)

Steel Mechanical Brushed Code Lock
Stock information temporarily unavailable.

Technical documents

Specifications

Series

TSW-107-07-L-D-006

Kit Type

First Responder Bag

Thread Length

17.5mm

Maximum Output Torque

1482 gcm

Dimensions

210 x 75 x 50mm

Free Length

94mm

Material

Steel

Country of Origin

China

Product details

TE connectivity AMPMODU 50/50 1.27mm x 1.27mm Double Row Board to Board Vertical Headers

AMPMODU 50/50 double row board to board SMT PCB mount vertical headers with a high density 1.27mm x 1.27mm centerline and a 6.35mm mated height for parallel board to board applications. These AMPMODU 50/50 board to board headers have metallic board holddowns, dual beam receptacle contacts and black UL 94V-0 LCP housings with keying to aid accurate mating.

TE Connectivity AMPMODU 50/50 1.27mm Connectors

The TE Connectivity Modu 50/50 is a high density 1.27mm grid board to board connection system for SMT assembly. Choice of three different heights for PCB headers allows versatile stacking solutions to be achieved.